TY - JOUR
T1 - 150-GHz CMOS TX/RX with Digitally Predistorted PAM-4 Modulation for Terahertz Contactless/Plastic Waveguide Communications
AU - Kim, Yanghyo
AU - Hu, Boyu
AU - Huang, Rulin
AU - Tang, Adrian
AU - Joye, Colin
AU - Itoh, Tatsuo
AU - Chang, Mau Chung Frank
N1 - Publisher Copyright:
© 2011-2012 IEEE.
PY - 2020/7
Y1 - 2020/7
N2 - In this article, 150-GHz CMOS transmitter (TX) and receiver (RX) are presented for contactless and plastic waveguide communications. The implemented system employs a four-level pulse-amplitude modulation (PAM-4) and noncoherent detection. The direct upconversion TX and self-mixing RX suffer amplitude nonlinearity and distort the carrier-modulated multilevel signals. A current-mode digital predistortion is integrated in the PAM-4 modulator to correct the nonlinearity for the carrier-modulated multilevel signaling. Coupling antennas are designed on FR4-HR substrates. The same antenna launches electromagnetic energy into plastic waveguides to extend the communication distance. A plastic printed circuit board (PCB) is introduced by inserting plastic waveguides into copper-coated slots on PCBs to realize terahertz PCB communications. The TX and RX are fabricated in the 28-nm standard bulk CMOS process. The system consumes 60.2 mW under 1.2/1.5 V supply while transferring 30 Gb/s PAM-4 data, achieving 2.01 pJ/bit energy efficiency.
AB - In this article, 150-GHz CMOS transmitter (TX) and receiver (RX) are presented for contactless and plastic waveguide communications. The implemented system employs a four-level pulse-amplitude modulation (PAM-4) and noncoherent detection. The direct upconversion TX and self-mixing RX suffer amplitude nonlinearity and distort the carrier-modulated multilevel signals. A current-mode digital predistortion is integrated in the PAM-4 modulator to correct the nonlinearity for the carrier-modulated multilevel signaling. Coupling antennas are designed on FR4-HR substrates. The same antenna launches electromagnetic energy into plastic waveguides to extend the communication distance. A plastic printed circuit board (PCB) is introduced by inserting plastic waveguides into copper-coated slots on PCBs to realize terahertz PCB communications. The TX and RX are fabricated in the 28-nm standard bulk CMOS process. The system consumes 60.2 mW under 1.2/1.5 V supply while transferring 30 Gb/s PAM-4 data, achieving 2.01 pJ/bit energy efficiency.
KW - CMOS
KW - contactless connector
KW - digital predistortion (DPD)
KW - four-level pulse-amplitude modulation (PAM-4) modulation
KW - plastic printed circuit board (PCB)
KW - plastic waveguide
KW - radio frequency (RF) mixing digital-to-analog converter (DAC)
KW - terahertz communication
UR - http://www.scopus.com/inward/record.url?scp=85089067474&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85089067474&partnerID=8YFLogxK
U2 - 10.1109/TTHZ.2020.2991303
DO - 10.1109/TTHZ.2020.2991303
M3 - Article
AN - SCOPUS:85089067474
SN - 2156-342X
VL - 10
SP - 370
EP - 382
JO - IEEE Transactions on Terahertz Science and Technology
JF - IEEE Transactions on Terahertz Science and Technology
IS - 4
M1 - 9082175
ER -