Original language | English |
---|---|
Title of host publication | Interfacial and Nanoscale Fracture |
Pages | 219-239 |
Number of pages | 21 |
Volume | 8 |
DOIs | |
State | Published - Jul 2007 |
8.06 - Thermomechanical Reliability of Microelectronic Packaging
Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review
11
Scopus
citations