8.06 - Thermomechanical Reliability of Microelectronic Packaging

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

11 Scopus citations
Original languageEnglish
Title of host publicationInterfacial and Nanoscale Fracture
Pages219-239
Number of pages21
Volume8
DOIs
StatePublished - Jul 2007

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