8.06 - Thermomechanical Reliability of Microelectronic Packaging

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

11 Scopus citations

Original language	English
Title of host publication	Interfacial and Nanoscale Fracture
Pages	219-239
Number of pages	21
Volume	8
DOIs	https://doi.org/10.1016/B0-08-043749-4/08040-X
State	Published - Jul 2007

Access to Document

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title = "8.06 - Thermomechanical Reliability of Microelectronic Packaging",

author = "J. Qu",

year = "2007",

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doi = "10.1016/B0-08-043749-4/08040-X",

language = "English",

isbn = "9780080437491",

volume = "8",

pages = "219--239",

booktitle = "Interfacial and Nanoscale Fracture",

}

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AU - Qu, J.

PY - 2007/7

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SN - 9780080437491

VL - 8

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BT - Interfacial and Nanoscale Fracture

ER -