8.06 - Thermomechanical Reliability of Microelectronic Packaging

Research output: Chapter in Book/Report/Conference proceeding › Chapter › peer-review

11 Scopus citations

Original language	English
Title of host publication	Interfacial and Nanoscale Fracture
Pages	219-239
Number of pages	21
Volume	8
DOIs	https://doi.org/10.1016/B0-08-043749-4/08040-X
State	Published - Jul 2007

Access to Document

@inbook{46ee4dc7cbbc417daffd6d63ee37a094,

title = "8.06 - Thermomechanical Reliability of Microelectronic Packaging",

author = "J. Qu",

year = "2007",

month = jul,

doi = "10.1016/B0-08-043749-4/08040-X",

language = "English",

isbn = "9780080437491",

volume = "8",

pages = "219--239",

booktitle = "Interfacial and Nanoscale Fracture",

}

TY - CHAP

T1 - 8.06 - Thermomechanical Reliability of Microelectronic Packaging

AU - Qu, J.

PY - 2007/7

Y1 - 2007/7

UR - https://www.scopus.com/pages/publications/79957914865

UR - https://www.scopus.com/inward/citedby.url?scp=79957914865&partnerID=8YFLogxK

U2 - 10.1016/B0-08-043749-4/08040-X

DO - 10.1016/B0-08-043749-4/08040-X

M3 - Chapter

AN - SCOPUS:79957914865

SN - 9780080437491

VL - 8

SP - 219

EP - 239

BT - Interfacial and Nanoscale Fracture

ER -