TY - JOUR
T1 - A 65 nm CMOS 330 Mb/s microwave backscatter link at 2.4 to 2.9 GHz with ambient blocker cancellation
AU - Tang, Adrian
AU - Kim, Yanghyo
AU - Chang, Mau Chung Frank
N1 - Publisher Copyright:
© 2015 IEEE.
PY - 2016/1
Y1 - 2016/1
N2 - This letter discusses the implementation of microwave backscatter links in CMOS technology which are similar to existing systems at mid-UHF for RFID, but intended for use at the 2.4 GHz ISM band towards higher data-rate wireless connectivity solutions. The demonstrated microwave backscatter link uses CMOS RFIC implementation as opposed to discrete components, enabling low power consumption, while maintaining a high modulation bandwidth. Similar to RFID readers, the prototype link also cancels the carrier self-leakage and ambient reflection with internal calibration within a base-station chip. The demonstrated link is implemented and characterized in a 65 nm CMOS technology and is shown to provide 330 Mb/s of raw data-rate with BERs better than} 10-9 over distances up to 2.5 m.
AB - This letter discusses the implementation of microwave backscatter links in CMOS technology which are similar to existing systems at mid-UHF for RFID, but intended for use at the 2.4 GHz ISM band towards higher data-rate wireless connectivity solutions. The demonstrated microwave backscatter link uses CMOS RFIC implementation as opposed to discrete components, enabling low power consumption, while maintaining a high modulation bandwidth. Similar to RFID readers, the prototype link also cancels the carrier self-leakage and ambient reflection with internal calibration within a base-station chip. The demonstrated link is implemented and characterized in a 65 nm CMOS technology and is shown to provide 330 Mb/s of raw data-rate with BERs better than} 10-9 over distances up to 2.5 m.
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U2 - 10.1109/LMWC.2015.2505650
DO - 10.1109/LMWC.2015.2505650
M3 - Article
AN - SCOPUS:84971656748
SN - 1531-1309
VL - 26
SP - 61
EP - 63
JO - IEEE Microwave and Wireless Components Letters
JF - IEEE Microwave and Wireless Components Letters
IS - 1
M1 - 7362257
ER -