Skip to main navigation Skip to search Skip to main content

A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate

Research output: Contribution to journal › Article › peer-review

69 Scopus citations

Fingerprint

Dive into the research topics of 'A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate'. Together they form a unique fingerprint.
Sort by

Material Science

Engineering