A multidisciplinary design and optimization methodology for ball grid array packages using artificial neural networks

Hamid Hadim, Tohru Suwa

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the artificial neural networks (ANNs) technique is presented. To demonstrate its capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered as a constraint. ANNs are used for thermal and structural performance predictions which resulted in large reduction in computational time. The present methodology is able to provide the designers a tool for systematic evaluation of the design trade-offs which are represented in the objective function. This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level.

Original languageEnglish
Pages (from-to)306-313
Number of pages8
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume127
Issue number3
DOIs
StatePublished - Sep 2005

Keywords

  • Ball Grid Array
  • Design Optimization
  • Electronics Packaging
  • Multidisciplinary Design
  • Neural Networks

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