TY - JOUR
T1 - A multidisciplinary design and optimization methodology for ball grid array packages using artificial neural networks
AU - Hadim, Hamid
AU - Suwa, Tohru
PY - 2005/9
Y1 - 2005/9
N2 - A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the artificial neural networks (ANNs) technique is presented. To demonstrate its capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered as a constraint. ANNs are used for thermal and structural performance predictions which resulted in large reduction in computational time. The present methodology is able to provide the designers a tool for systematic evaluation of the design trade-offs which are represented in the objective function. This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level.
AB - A systematic multidisciplinary electronics packaging design and optimization methodology, which takes into account the complexity of multiple design trade-offs, operated in conjunction with the artificial neural networks (ANNs) technique is presented. To demonstrate its capability, this method is applied to a plastic ball grid array package design. Multidisciplinary criteria including thermal, structural, electromagnetic leakage, and cost are optimized simultaneously using key design parameters as variables. A simplified routability criterion is also considered as a constraint. ANNs are used for thermal and structural performance predictions which resulted in large reduction in computational time. The present methodology is able to provide the designers a tool for systematic evaluation of the design trade-offs which are represented in the objective function. This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level.
KW - Ball Grid Array
KW - Design Optimization
KW - Electronics Packaging
KW - Multidisciplinary Design
KW - Neural Networks
UR - http://www.scopus.com/inward/record.url?scp=26844468535&partnerID=8YFLogxK
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U2 - 10.1115/1.1997161
DO - 10.1115/1.1997161
M3 - Article
AN - SCOPUS:26844468535
SN - 1043-7398
VL - 127
SP - 306
EP - 313
JO - Journal of Electronic Packaging, Transactions of the ASME
JF - Journal of Electronic Packaging, Transactions of the ASME
IS - 3
ER -