TY - GEN
T1 - A Multidisciplinary Design and Optimization Methodology in Electronics Packaging
T2 - 2003 ASME Summer Heat Transfer Conference (HT2003)
AU - Hadim, Hamid
AU - Suwa, Tohru
PY - 2003
Y1 - 2003
N2 - In this manuscript a systematic multidisciplinary electronic packaging design and optimization methodology based on the artificial neural networks technique is presented. This method is applied to a Ball Grid Array (BGA) package design as an example. Multidisciplinary criteria including thermal, structural (thermal strain), electromagnetic leakage, and cost are optimized simultaneously. A simplified routability criterion is also considered as a constraint. The artificial neural networks technique is used for thermal and structural performance predictions. Large calculation time reduction is achieved using the artificial neural networks, which also provide enough information to specify the individual weights for each design discipline within the objective function used for optimization. This methodology is able to provide the designers a clear view of the design trade-offs, which are represented in the objective function using various design parameters. This methodology can be applied to any electronic product design at any packaging level.
AB - In this manuscript a systematic multidisciplinary electronic packaging design and optimization methodology based on the artificial neural networks technique is presented. This method is applied to a Ball Grid Array (BGA) package design as an example. Multidisciplinary criteria including thermal, structural (thermal strain), electromagnetic leakage, and cost are optimized simultaneously. A simplified routability criterion is also considered as a constraint. The artificial neural networks technique is used for thermal and structural performance predictions. Large calculation time reduction is achieved using the artificial neural networks, which also provide enough information to specify the individual weights for each design discipline within the objective function used for optimization. This methodology is able to provide the designers a clear view of the design trade-offs, which are represented in the objective function using various design parameters. This methodology can be applied to any electronic product design at any packaging level.
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U2 - 10.1115/ht2003-47524
DO - 10.1115/ht2003-47524
M3 - Conference contribution
AN - SCOPUS:1842640181
SN - 0791836959
SN - 9780791836958
T3 - Proceedings of the ASME Summer Heat Transfer Conference
SP - 557
EP - 564
BT - Proceedings of the 2003 ASME Summer Heat Transfer Conference, Volume 3
Y2 - 21 July 2003 through 23 July 2003
ER -