TY - GEN
T1 - A multiscale modeling method for the creep behavior of SnAg solder alloys
AU - Pei, Min
AU - Qu, Jianmin
PY - 2007
Y1 - 2007
N2 - In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of sub-micron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
AB - In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of sub-micron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
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U2 - 10.1115/IPACK2007-33703
DO - 10.1115/IPACK2007-33703
M3 - Conference contribution
AN - SCOPUS:40449097761
SN - 0791842770
SN - 9780791842775
T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
SP - 115
EP - 120
BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
T2 - ASME Electronic and Photonics Packaging Division
Y2 - 8 July 2007 through 12 July 2007
ER -