A multiscale modeling method for the creep behavior of SnAg solder alloys

Min Pei, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of sub-micron size Ag3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages115-120
Number of pages6
DOIs
StatePublished - 2007
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 8 Jul 200712 Jul 2007

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume2

Conference

ConferenceASME Electronic and Photonics Packaging Division
Country/TerritoryUnited States
CityVancouver, BC
Period8/07/0712/07/07

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