A new Geopole™ cooling technique for outdoor electronic enclosures

Engineering

• Thermal Performance 100%
• Parametric Study 50%
• Demonstrates 50%
• Thermal Model 50%
• Forced Convection 50%
• Design Parameter 50%
• Feasibility Study 50%
• Internals 50%
• Closed Loop 50%
• Outer Surface 50%
• Heat Sink 50%
• Ground Level 50%