A simplified thermal analysis and design methodology for printed circuit boards

Research output: Contribution to journalArticlepeer-review

Abstract

A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.

Original languageEnglish
Pages (from-to)339-342
Number of pages4
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume115
Issue number3
DOIs
StatePublished - Sep 1993

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