Abstract
A simplified methodology is developed for thermal analysis and design of printed circuit boards. It combines the use of computer-aided thermal network modeling and a simplified experimental technique. In order to demonstrate its capabilities, this methodology is implemented to correlate natural convection on a printed circuit board oriented horizontally inside an enclosure. The empirical constants used in the correlation were determined through a numerical algorithm in which the sum of the squared error between calculated temperatures and experimental measurements is minimized using the downhill simplex algorithm.
| Original language | English |
|---|---|
| Pages (from-to) | 339-342 |
| Number of pages | 4 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 115 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 1993 |