TY - GEN
T1 - A wafer transfer technology for MEMS adaptive optics
AU - Yang, Eui Hveok
AU - Wiberg, Dean V.
PY - 2001
Y1 - 2001
N2 - Adaptive optics systems require the combination of several advanced technologies such as precision optics, wavefront sensors, deformable mirrors and lasers with high-speed control systems. The deformable mirror with a continuous membrane is a key component of these systems. This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. This technology is developed for the fabrication of a compact deformable mirror with a continuous face sheet. A 1 μm thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or larger diameter membranes can also be transferred using this technique. The fabricated actuator membrane with an electrode gap of 1.5 μm shows a vertical deflection of 0.37 urn at 55 V. The proposed technique has the following benefits over those previously reported: 1) No post-assembly release process (e.g. using HF) is required, and no wax, photoresist, or epoxy is used for the transfer purpose 2) The bonded interface is completely isolated from any acid, etchant, or solvent, which ensures a clean and flat membrane surface. 3) It offers the capability of transferring wafer-level membranes over deformable actuators.
AB - Adaptive optics systems require the combination of several advanced technologies such as precision optics, wavefront sensors, deformable mirrors and lasers with high-speed control systems. The deformable mirror with a continuous membrane is a key component of these systems. This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. This technology is developed for the fabrication of a compact deformable mirror with a continuous face sheet. A 1 μm thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or larger diameter membranes can also be transferred using this technique. The fabricated actuator membrane with an electrode gap of 1.5 μm shows a vertical deflection of 0.37 urn at 55 V. The proposed technique has the following benefits over those previously reported: 1) No post-assembly release process (e.g. using HF) is required, and no wax, photoresist, or epoxy is used for the transfer purpose 2) The bonded interface is completely isolated from any acid, etchant, or solvent, which ensures a clean and flat membrane surface. 3) It offers the capability of transferring wafer-level membranes over deformable actuators.
UR - http://www.scopus.com/inward/record.url?scp=1542537649&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1542537649&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:1542537649
SN - 0791835553
SN - 9780791835555
T3 - American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)
SP - 51
EP - 55
BT - Micro-Electro-Mechanical Systems (MEMS) - 2001
A2 - Lee, A.L.
A2 - Simon, J.
A2 - Breuer, K.
A2 - Chen, S.
A2 - Keynton, R.S.
A2 - Malshe, A.
A2 - Mou, J.-I.
A2 - Dunn, M.
T2 - 2001 ASME International Mechanical Engineering Congress and Exposition
Y2 - 11 November 2001 through 16 November 2001
ER -