Additive occupancy in the Cu 6Sn 5-based intermetallic compound between Sn-3.5ag solder and cu studied using a first-principles approach
- Feng Gao
- , Jianmin Qu
- , Tadashi Takemoto
- Georgia Institute of Technology
- Northwestern University
- The University of Osaka
Research output: Contribution to journal › Article › peer-review
53
Scopus
citations