Adhesion enhancement of underfill materials by silane additives

Qizhou Yao, Jianmin Qu, Jaili Wu, C. P. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

In this paper, the fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. A small amount of silane coupling agent is added to the base underfill to form various underfill derivatives. Double layer specimens with pre-existing interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness depends greatly on the type of substrate. The results of this study have important implications for flip-chip reliability, where interfacial cracking is one of the major failure modes.

Original languageEnglish
Title of host publicationProceedings - International Symposium on Advanced Packaging Materials
Subtitle of host publicationProcesses, Properties and Interfaces
Pages27-30
Number of pages4
ISBN (Electronic)0930815564, 9780930815561
DOIs
StatePublished - 1999
Event1999 International Symposium on Advanced Packaging Materials - Braselton, United States
Duration: 14 Mar 199917 Mar 1999

Publication series

NameProceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Conference

Conference1999 International Symposium on Advanced Packaging Materials
Country/TerritoryUnited States
CityBraselton
Period14/03/9917/03/99

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