TY - GEN
T1 - Adhesion enhancement of underfill materials by silane additives
AU - Yao, Qizhou
AU - Qu, Jianmin
AU - Wu, Jaili
AU - Wong, C. P.
N1 - Publisher Copyright:
© 1999 IEEE.
PY - 1999
Y1 - 1999
N2 - In this paper, the fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. A small amount of silane coupling agent is added to the base underfill to form various underfill derivatives. Double layer specimens with pre-existing interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness depends greatly on the type of substrate. The results of this study have important implications for flip-chip reliability, where interfacial cracking is one of the major failure modes.
AB - In this paper, the fracture toughness of the interfaces between epoxy-based underfill materials and various substrates is experimentally measured. A small amount of silane coupling agent is added to the base underfill to form various underfill derivatives. Double layer specimens with pre-existing interfacial cracks are made for four-point bending tests. The substrates tested include aluminum, polyimide, BCB, and printed wiring boards (FR-4) with solder mask. The measurements are qualitatively correlated to each silane additive. Although the purpose of adding silane additives was to enhance the adhesion, it is found that the enhancement of interfacial toughness depends greatly on the type of substrate. The results of this study have important implications for flip-chip reliability, where interfacial cracking is one of the major failure modes.
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U2 - 10.1109/ISAPM.1999.757282
DO - 10.1109/ISAPM.1999.757282
M3 - Conference contribution
AN - SCOPUS:84865848936
T3 - Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
SP - 27
EP - 30
BT - Proceedings - International Symposium on Advanced Packaging Materials
T2 - 1999 International Symposium on Advanced Packaging Materials
Y2 - 14 March 1999 through 17 March 1999
ER -