TY - GEN
T1 - An engineering model for moisture degradation of polymer/metal interfacial fracture toughness
AU - Ferguson, Timothy P.
AU - Qu, Jianmin
PY - 2005
Y1 - 2005
N2 - based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
AB - based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
UR - http://www.scopus.com/inward/record.url?scp=33746539557&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33746539557&partnerID=8YFLogxK
U2 - 10.1109/ISAPM.2005.1432093
DO - 10.1109/ISAPM.2005.1432093
M3 - Conference contribution
AN - SCOPUS:33746539557
SN - 0780390857
SN - 9780780390850
T3 - Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
SP - 298
EP - 301
BT - Proceedings - 2005 10th International Symposium on Advanced Packaging Materials
T2 - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Y2 - 16 March 2005 through 18 March 2005
ER -