An engineering model for moisture degradation of polymer/metal interfacial fracture toughness

Timothy P. Ferguson, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.

Original languageEnglish
Title of host publicationProceedings - 2005 10th International Symposium on Advanced Packaging Materials
Subtitle of host publicationProcesses, Properties and Interfaces
Pages298-301
Number of pages4
DOIs
StatePublished - 2005
Event2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States
Duration: 16 Mar 200518 Mar 2005

Publication series

NameProceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Volume2005

Conference

Conference2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Country/TerritoryUnited States
CityIrvine, CA
Period16/03/0518/03/05

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