TY - GEN
T1 - An engineering model for moisture degradation of polymer/metal interfacial fracture toughness
AU - Ferguson, Timothy P.
AU - Qu, Jianmin
PY - 2006
Y1 - 2006
N2 - based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
AB - based on interfacial fracture mechanics and the hydrophobicity of the interface, en engineering model was developed in this paper. Using this model, one can predicted the degradation of interfacial fracture toughness of a polymer/metal interface once the moisture concentration near the interface is known.
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UR - http://www.scopus.com/inward/citedby.url?scp=32844461322&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:32844461322
SN - 0791842002
SN - 9780791842003
T3 - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
SP - 1661
EP - 1664
BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Y2 - 17 July 2005 through 22 July 2005
ER -