An interfacing software package for thermal analysis: Application to microelectronics

A. Hadim, A. T. Chang, A. Chu, A. Yskamp

Research output: Contribution to journalArticlepeer-review

3 Scopus citations

Abstract

A software package called: INterfacing Software for Thermal ANalysis (INSTAN) is developed to interface finite element general purpose programs with finitedifference thermal network analyzers for detailed analysis of complex thermal problems. The finite element mesh is used to generate the thermal network representation of the problem. INSTAN performs automatically the thermal network calculations and generates a complete input file for the thermal analysis program. The INSTAN software package is a powerful modeling tool which uses the preprocessing and postprocessing features available in a finite element program. It has also the flexibility and heat transfer calculation capabilities of a finite-difference program. It can handle problems with three-dimensional irregular geometries, time and temperature dependent properties, and anisotropic materials. The software possesses enhanced capabilities that make it suitable for thermal analysis of microelectronic equipment.

Original languageEnglish
Pages (from-to)54-60
Number of pages7
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume111
Issue number1
DOIs
StatePublished - Mar 1989

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