An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations

Shaorui Yang; Jianmin Qu

doi:10.1109/EuroSimE.2014.6813791

An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations

Shaorui Yang, Jianmin Qu

Northwestern University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate. Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is found that, under uniaxial strain, plastic deformation in the epoxy/Cu bimaterial is localized to a thin layer of epoxy next to the epoxy/Cu interface. This discovery enables the definition of an interfacial zone. Consequently, a macroscopic cohesive zone model can be constructed at the continuum level where the separation of the interface is given by the stretching of the interfacial zone in its thickness direction.

Original language	English
Title of host publication	2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
DOIs	https://doi.org/10.1109/EuroSimE.2014.6813791
State	Published - 2014
Event	2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 - Ghent, Belgium Duration: 7 Apr 2014 → 9 Apr 2014

Publication series

Name	2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014

Conference

Conference	2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014
Country/Territory	Belgium
City	Ghent
Period	7/04/14 → 9/04/14

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10.1109/EuroSimE.2014.6813791

Cite this

Yang, S., & Qu, J. (2014). An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations. In 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 Article 6813791 (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014). https://doi.org/10.1109/EuroSimE.2014.6813791

Yang, Shaorui ; Qu, Jianmin. / An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations. 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. 2014. (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).

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title = "An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations",

abstract = "In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate. Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is found that, under uniaxial strain, plastic deformation in the epoxy/Cu bimaterial is localized to a thin layer of epoxy next to the epoxy/Cu interface. This discovery enables the definition of an interfacial zone. Consequently, a macroscopic cohesive zone model can be constructed at the continuum level where the separation of the interface is given by the stretching of the interfacial zone in its thickness direction.",

author = "Shaorui Yang and Jianmin Qu",

year = "2014",

doi = "10.1109/EuroSimE.2014.6813791",

language = "English",

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series = "2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014",

booktitle = "2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014",

note = "2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014 ; Conference date: 07-04-2014 Through 09-04-2014",

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Yang, S & Qu, J 2014, An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations. in 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014., 6813791, 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014, Ghent, Belgium, 7/04/14. https://doi.org/10.1109/EuroSimE.2014.6813791

An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations. / Yang, Shaorui; Qu, Jianmin.
2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. 2014. 6813791 (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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N2 - In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate. Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is found that, under uniaxial strain, plastic deformation in the epoxy/Cu bimaterial is localized to a thin layer of epoxy next to the epoxy/Cu interface. This discovery enables the definition of an interfacial zone. Consequently, a macroscopic cohesive zone model can be constructed at the continuum level where the separation of the interface is given by the stretching of the interfacial zone in its thickness direction.

AB - In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate. Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is found that, under uniaxial strain, plastic deformation in the epoxy/Cu bimaterial is localized to a thin layer of epoxy next to the epoxy/Cu interface. This discovery enables the definition of an interfacial zone. Consequently, a macroscopic cohesive zone model can be constructed at the continuum level where the separation of the interface is given by the stretching of the interfacial zone in its thickness direction.

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Yang S, Qu J. An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations. In 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. 2014. 6813791. (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014). doi: 10.1109/EuroSimE.2014.6813791

An investigation of the tensile deformation and failure of an epoxy/Cu interface using coarse-grained molecular dynamics simulations

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