Computational characterization of adhesive bond properties using guided waves in bonded plates

Juergen Koreck, Christine Valle, Jianmin Qu, Laurence J. Jacobs

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This research focuses on the application of guided waves techniques to nondestructively characterize the structural integrity of bonded engineering components. Computational methods are used to examine the properties of double-layered, adhesive bonded plates. This study quantifies the effect of the adhesive bond parameters (Young's modulus, Poisson's ratio and bond thickness) on the dispersion curves. A commercial finite element (FE) code (ABAQUS/Explicit) is used for the numerical model while the global matrix method (GMM) is used to benchmark the resulting dispersion relationships in the form of a frequency-wavenumber or slowness-frequency relation. In the dispersion relations, a set of bond parameter sensitive and FE-visible points is selected. The frequency locations of these points represent the solution criteria for the inversion procedure based on the global matrix method. The capabilities of the inversion process depend on the number of transient output signals from a FE simulation for the forward problem.

Original languageEnglish
Title of host publicationReview of Progress in Quantitative Nondestructive Evaluation
Subtitle of host publicationVolume 26
Pages1111-1118
Number of pages8
DOIs
StatePublished - 2007
EventREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION - Portland, OR, United States
Duration: 30 Jul 20064 Aug 2006

Publication series

NameAIP Conference Proceedings
Volume894
ISSN (Print)0094-243X
ISSN (Electronic)1551-7616

Conference

ConferenceREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION
Country/TerritoryUnited States
CityPortland, OR
Period30/07/064/08/06

Keywords

  • Adhesive bonds
  • Dispersion curves
  • Finite element method
  • Guided waves
  • Lamb waves

Fingerprint

Dive into the research topics of 'Computational characterization of adhesive bond properties using guided waves in bonded plates'. Together they form a unique fingerprint.

Cite this