Abstract
A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.
Original language | English |
---|---|
Pages | 702-706 |
Number of pages | 5 |
State | Published - 1995 |
Event | Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA Duration: 7 May 1995 → 11 Oct 1995 |
Conference
Conference | Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) |
---|---|
City | Boston, MA, USA |
Period | 7/05/95 → 11/10/95 |