Computer-aided design methodology for mold cooling

Research output: Contribution to conferencePaperpeer-review

Abstract

A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.

Original languageEnglish
Pages702-706
Number of pages5
StatePublished - 1995
EventProceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA
Duration: 7 May 199511 Oct 1995

Conference

ConferenceProceedings of the 53rd Annual Technical Conference. Part 1 (of 3)
CityBoston, MA, USA
Period7/05/9511/10/95

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