Computer-aided design methodology for mold cooling

H. A. Hadim; K. Xu

Computer-aided design methodology for mold cooling

H. A. Hadim
, K. Xu

Department of Mechanical Engineering

Stevens Institute of Technology

Research output: Contribution to conference › Paper › peer-review

Abstract

A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.

Original language	English
Pages	702-706
Number of pages	5
State	Published - 1995
Event	Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) - Boston, MA, USA Duration: 7 May 1995 → 11 Oct 1995

Conference

Conference	Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3)
City	Boston, MA, USA
Period	7/05/95 → 11/10/95

Cite this

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title = "Computer-aided design methodology for mold cooling",

abstract = "A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.",

author = "Hadim, \{H. A.\} and K. Xu",

year = "1995",

language = "English",

pages = "702--706",

note = "Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3) ; Conference date: 07-05-1995 Through 11-10-1995",

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TY - CONF

T1 - Computer-aided design methodology for mold cooling

AU - Hadim, H. A.

AU - Xu, K.

PY - 1995

Y1 - 1995

N2 - A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.

AB - A computer-aided design and analysis methodology based on thermal network modelling was developed for efficient simulation of heat transfer within the mold. To demonstrate its capabilities, the methodology was used for efficient thermal design of mold inserts. Parametric studies were performed to analyze the effect of thermal contact resistance, insert size, and the heat flux on the thermal behavior of the mold and the corresponding change in cooling time.

UR - https://www.scopus.com/pages/publications/0029232170

UR - https://www.scopus.com/pages/publications/0029232170#tab=citedBy

M3 - Paper

AN - SCOPUS:0029232170

SP - 702

EP - 706

T2 - Proceedings of the 53rd Annual Technical Conference. Part 1 (of 3)

Y2 - 7 May 1995 through 11 October 1995

ER -

Computer-aided design methodology for mold cooling

Abstract

Conference

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