Constitutive modeling of lead-free solders

M. Pel; J. Qu

doi:10.1109/ISAPM.2005.1432043

Constitutive modeling of lead-free solders

M. Pel, J. Qu

Georgia Institute of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

53 Scopus citations

Abstract

Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.

Original language	English
Title of host publication	Proceedings - 2005 10th International Symposium on Advanced Packaging Materials
Subtitle of host publication	Processes, Properties and Interfaces
Pages	45-49
Number of pages	5
DOIs	https://doi.org/10.1109/ISAPM.2005.1432043
State	Published - 2005
Event	2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces - Irvine, CA, United States Duration: 16 Mar 2005 → 18 Mar 2005

Publication series

Name	Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces
Volume	2005

Conference

Conference	2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
Country/Territory	United States
City	Irvine, CA
Period	16/03/05 → 18/03/05

Access to Document

10.1109/ISAPM.2005.1432043

Cite this

Pel, M., & Qu, J. (2005). Constitutive modeling of lead-free solders. In Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (pp. 45-49). Article 1432043 (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; Vol. 2005). https://doi.org/10.1109/ISAPM.2005.1432043

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title = "Constitutive modeling of lead-free solders",

abstract = "Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.",

author = "M. Pel and J. Qu",

year = "2005",

doi = "10.1109/ISAPM.2005.1432043",

language = "English",

isbn = "0780390857",

series = "Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces",

pages = "45--49",

booktitle = "Proceedings - 2005 10th International Symposium on Advanced Packaging Materials",

note = "2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces ; Conference date: 16-03-2005 Through 18-03-2005",

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Pel, M & Qu, J 2005, Constitutive modeling of lead-free solders. in Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces., 1432043, Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, vol. 2005, pp. 45-49, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, Irvine, CA, United States, 16/03/05. https://doi.org/10.1109/ISAPM.2005.1432043

Constitutive modeling of lead-free solders. / Pel, M.; Qu, J.
Proceedings - 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces. 2005. p. 45-49 1432043 (Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces; Vol. 2005).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AB - Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical testing on several commercial lead-free solder alloys. Anand viscoplastic model was used to describe the behavior of these materials with new curve fitting techniques. A modified Anand models was proposed that can yield a more accurate description of lead-free solders.

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ER -

Constitutive modeling of lead-free solders

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