Copper nanotubes for packaging applications

Daniel Choi, Viola Fucsko, Eui Hyeok Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, we present a process for fabricating Copper (Cu) nanotubes, which can be utilized for novel electrical interconnect materials. Because of superior properties in electromigration and thermal management to aluminum, Cu technology has been attractive to the semiconductor industry. Cu nanotubes can be fabricated by electrodeposition using alumina nanopore templates. Nanotubes can provide high surface-to-volume ratio in nanostructures compared to nanorods. In addition, nanotubes provide lower resistively and high thermal conductivity. Cu nanotube arrays were electrodeposited into alumina nanopore membranes with pore diameters of approximately 30nm and 50nm, with estimated porosity of 43%, by nano template-based electrodeposition.

Original languageEnglish
Title of host publication2008 IEEE Aerospace Conference, AC
DOIs
StatePublished - 2008
Event2008 IEEE Aerospace Conference, AC - Big Sky, MT, United States
Duration: 1 Mar 20088 Mar 2008

Publication series

NameIEEE Aerospace Conference Proceedings
ISSN (Print)1095-323X

Conference

Conference2008 IEEE Aerospace Conference, AC
Country/TerritoryUnited States
CityBig Sky, MT
Period1/03/088/03/08

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