TY - GEN
T1 - Copper nanotubes for packaging applications
AU - Choi, Daniel
AU - Fucsko, Viola
AU - Yang, Eui Hyeok
PY - 2008
Y1 - 2008
N2 - In this paper, we present a process for fabricating Copper (Cu) nanotubes, which can be utilized for novel electrical interconnect materials. Because of superior properties in electromigration and thermal management to aluminum, Cu technology has been attractive to the semiconductor industry. Cu nanotubes can be fabricated by electrodeposition using alumina nanopore templates. Nanotubes can provide high surface-to-volume ratio in nanostructures compared to nanorods. In addition, nanotubes provide lower resistively and high thermal conductivity. Cu nanotube arrays were electrodeposited into alumina nanopore membranes with pore diameters of approximately 30nm and 50nm, with estimated porosity of 43%, by nano template-based electrodeposition.
AB - In this paper, we present a process for fabricating Copper (Cu) nanotubes, which can be utilized for novel electrical interconnect materials. Because of superior properties in electromigration and thermal management to aluminum, Cu technology has been attractive to the semiconductor industry. Cu nanotubes can be fabricated by electrodeposition using alumina nanopore templates. Nanotubes can provide high surface-to-volume ratio in nanostructures compared to nanorods. In addition, nanotubes provide lower resistively and high thermal conductivity. Cu nanotube arrays were electrodeposited into alumina nanopore membranes with pore diameters of approximately 30nm and 50nm, with estimated porosity of 43%, by nano template-based electrodeposition.
UR - http://www.scopus.com/inward/record.url?scp=49349083875&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=49349083875&partnerID=8YFLogxK
U2 - 10.1109/AERO.2008.4526481
DO - 10.1109/AERO.2008.4526481
M3 - Conference contribution
AN - SCOPUS:49349083875
SN - 1424414881
SN - 9781424414888
T3 - IEEE Aerospace Conference Proceedings
BT - 2008 IEEE Aerospace Conference, AC
T2 - 2008 IEEE Aerospace Conference, AC
Y2 - 1 March 2008 through 8 March 2008
ER -