TY - JOUR
T1 - Creep and fatigue behavior of SnAg solders with lanthanum doping
AU - Pei, Min
AU - Qu, Jianmin
PY - 2008
Y1 - 2008
N2 - In this paper, extensive testing was conducted to study the effects of Lanthanum (La) doping on the creep and fatigue behavior of SnAg lead free solder alloys. Variables considered in this paper include doping amount, aging temperature, and aging time. The experimental data show that rare earth element (RE) doping increases SnAg solders creep resistance by about 15%. Meanwhile, RE doping does not affect thermal aging behavior of the solder alloy. A microstructure dependent Anand viscoplastic model is proposed to capture the RE doping effect on the creep behavior. Good agreement between the model predictions and experimental data are obtained. In addition, fatigue tests were performed with bulk specimen. It is found that La doping increases the fatigue life by about five times. The optimal doping level for better fatigue performance is around 0.1%.
AB - In this paper, extensive testing was conducted to study the effects of Lanthanum (La) doping on the creep and fatigue behavior of SnAg lead free solder alloys. Variables considered in this paper include doping amount, aging temperature, and aging time. The experimental data show that rare earth element (RE) doping increases SnAg solders creep resistance by about 15%. Meanwhile, RE doping does not affect thermal aging behavior of the solder alloy. A microstructure dependent Anand viscoplastic model is proposed to capture the RE doping effect on the creep behavior. Good agreement between the model predictions and experimental data are obtained. In addition, fatigue tests were performed with bulk specimen. It is found that La doping increases the fatigue life by about five times. The optimal doping level for better fatigue performance is around 0.1%.
KW - Constitutive law
KW - Creep
KW - Lead free solder
KW - Rare earth element (RE)
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U2 - 10.1109/TCAPT.2008.922002
DO - 10.1109/TCAPT.2008.922002
M3 - Article
AN - SCOPUS:54849142500
SN - 1521-3331
VL - 31
SP - 712
EP - 718
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 3
ER -