TY - GEN
T1 - Creep behavior characterization of some new materials for high density interconnect substrates using dynamic mechanical analyzer (DMA)
AU - Wong, C. P.
AU - Rao, Yang
AU - Qu, Jianmin
AU - Wu, Sean X.
N1 - Publisher Copyright:
© 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - Low-cost, high density interconnects (HDI) printed wiring board (PWB) is a critical technology for the next generation of high performance microelectronics. The precise characterization of the dielectr material used in the PWB and the solder mask, in particular, has significant effects on the HDI fabrication and reliability. For example, the design and reliability modeling of the HDI substrate depend crucially on the deformation rate and stress-strain relationship of these materials under specific thermal cyclic loading conditions. Dynamic mechanical analyzer (DMA) is a powerful instrument in measuring the viscoelasticity of materials in bending, compression, tension and shear. Using the TMA CONTROL FORCE testing mode of DMA, the creep behavior of some new dielectric and solder mask materials has been investigated and analyzed under different stress and temperature conditions. The results of this study provide critical parameters for the modeling of HDI substrate.
AB - Low-cost, high density interconnects (HDI) printed wiring board (PWB) is a critical technology for the next generation of high performance microelectronics. The precise characterization of the dielectr material used in the PWB and the solder mask, in particular, has significant effects on the HDI fabrication and reliability. For example, the design and reliability modeling of the HDI substrate depend crucially on the deformation rate and stress-strain relationship of these materials under specific thermal cyclic loading conditions. Dynamic mechanical analyzer (DMA) is a powerful instrument in measuring the viscoelasticity of materials in bending, compression, tension and shear. Using the TMA CONTROL FORCE testing mode of DMA, the creep behavior of some new dielectric and solder mask materials has been investigated and analyzed under different stress and temperature conditions. The results of this study provide critical parameters for the modeling of HDI substrate.
KW - Creep Behavior
KW - Dielectric Material
KW - Dynamic Mechanical Analyzer (DMA)
KW - High Density Interconnect (HDL)
KW - Solder Mask
KW - Stress-Strain Relationship
UR - https://www.scopus.com/pages/publications/0032230783
UR - https://www.scopus.com/inward/citedby.url?scp=0032230783&partnerID=8YFLogxK
U2 - 10.1109/ISAPM.1998.664437
DO - 10.1109/ISAPM.1998.664437
M3 - Conference contribution
AN - SCOPUS:0032230783
T3 - Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
SP - 73
EP - 76
BT - Proceedings - 4th International Symposium on Advanced Packaging Materials
T2 - 1998 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, APM 1998
Y2 - 15 March 1998 through 18 March 1998
ER -