TY - JOUR
T1 - Delamination cracking in encapsulated flip chips
AU - Le Gall, Carole A.
AU - Qu, Jianmin
AU - McDowell, David L.
PY - 1996
Y1 - 1996
N2 - In this paper, finite element analyses of delamination in flip chip assemblies are described to investigate delamination at the encapsulant/chip interface along the thickness of the chip under thermal loading, and to determine the potential for interconnection failures resulting from this type of delamination. It is shown that operating conditions, the mismatch in thermal expansion between the silicon chip of a flip chip assembly and an organic substrate subjects the solder joints to extremely large strains, which may result in premature failure of the solder connections. Although underfill encapsulation can reduce the strains in the solder joints, it results in the potential for cracking at the chip-underfill-substrate interfaces during temperature cycling.
AB - In this paper, finite element analyses of delamination in flip chip assemblies are described to investigate delamination at the encapsulant/chip interface along the thickness of the chip under thermal loading, and to determine the potential for interconnection failures resulting from this type of delamination. It is shown that operating conditions, the mismatch in thermal expansion between the silicon chip of a flip chip assembly and an organic substrate subjects the solder joints to extremely large strains, which may result in premature failure of the solder connections. Although underfill encapsulation can reduce the strains in the solder joints, it results in the potential for cracking at the chip-underfill-substrate interfaces during temperature cycling.
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M3 - Conference article
AN - SCOPUS:0029697087
SN - 0569-5503
SP - 430
EP - 434
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - Proceedings of the 1996 IEEE 46th Electronic Components & Technology Conference, ECTC
Y2 - 28 May 1996 through 31 May 1996
ER -