TY - JOUR
T1 - Detachable Dry-Coupled Ultrasonic Power Transfer Through Metallic Enclosures
AU - Allam, Ahmed
AU - Patel, Herit
AU - Sugino, Christopher
AU - Arrington, Christian
AU - John, Christopher St
AU - Steinfeldt, Jeffrey
AU - Erturk, Alper
AU - Elkady, Ihab
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - Ultrasonic waves can be used to transfer power and data to electronic devices in sealed metallic enclosures. Two piezoelectric transducers are used to transmit and receive elastic waves that propagate through the metal. For an efficient power transfer, both transducers are typically bonded to the metal or coupled with a gel which limits the device portability. We present an ultrasonic power transfer system with a detachable transmitter that uses a dry elastic layer and a magnetic joint for efficient coupling. We show that the system can deliver more than 2 W of power to an electric load with 50% efficiency.
AB - Ultrasonic waves can be used to transfer power and data to electronic devices in sealed metallic enclosures. Two piezoelectric transducers are used to transmit and receive elastic waves that propagate through the metal. For an efficient power transfer, both transducers are typically bonded to the metal or coupled with a gel which limits the device portability. We present an ultrasonic power transfer system with a detachable transmitter that uses a dry elastic layer and a magnetic joint for efficient coupling. We show that the system can deliver more than 2 W of power to an electric load with 50% efficiency.
KW - Acoustic power transfer
KW - dry coupling
KW - ultrasonic power transfer
UR - http://www.scopus.com/inward/record.url?scp=85122898531&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85122898531&partnerID=8YFLogxK
U2 - 10.1109/IUS52206.2021.9593569
DO - 10.1109/IUS52206.2021.9593569
M3 - Conference article
AN - SCOPUS:85122898531
SN - 1948-5719
JO - IEEE International Ultrasonics Symposium, IUS
JF - IEEE International Ultrasonics Symposium, IUS
T2 - 2021 IEEE International Ultrasonics Symposium, IUS 2021
Y2 - 11 September 2011 through 16 September 2011
ER -