Development of latching type large vertical-travel microactuator

Risaku Toda, Eui Hyeok Yang

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

3 Scopus citations

Abstract

This paper describes design, fabrication and preliminary characterization of a proof-of-conccpt vertical-travel microactuator, providing linear motion and high precision positioning in space. The microactuator is capable of providing latching function when it is un-powered to maintain its position. The microactuator consists of two opposing comb drive actuator dies, a slider and bulk PZT actuators sandwiched between the dies. The slider is inserted between clutches. Comb drives are connected to the clutches to engage/disengage clutching. Sequential activation of the comb drives (in-plane motion) and the PZT actuator (out-of-plane motion) provides cumulative linear travel of the slider. The novelty of the slider insertion approach include (1) post-fabrication engagement of comb teeth enabling thick wafer DRIE process for comb drive actuators and (2) stressed tethers enabling zero-power latching. A test device was fabricated and assembled. By applying 100V-300V DC to the electrostatic comb drive, lateral actuation of clutches was observed. Vertical actuation by PZT was also confirmed using WYKO RST plus interferometer.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems
Subtitle of host publicationAdvances in Electronic Packaging 2005
Pages1755-1759
Number of pages5
StatePublished - 2006
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: 17 Jul 200522 Jul 2005

Publication series

NameProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
VolumePART C

Conference

ConferenceASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country/TerritoryUnited States
CitySan Francisco, CA
Period17/07/0522/07/05

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