TY - JOUR
T1 - Dimple-type failures in a polymer/roughened metal system
AU - Lee, Ho Young
AU - Qu, Jianmin
PY - 2004
Y1 - 2004
N2 - Roughening of metal surfaces frequently enhances the adhesion strength of polymers to metals by mechanical interlocking. When a failure occurs in a polymer/roughened metal system, the failure is prone to be cohesive within the polymer. In a previous work, an adhesion study on a polymer (epoxy molding compound, EMC/roughened metal (brown-oxide-coated copper-based leadframe) system was carried out, and the correlation between the failure path and adhesion strength was investigated. In the present work, an attempt to explain why such failure paths occurred was made under the assumption that microvoids were formed in the EMC, as well as near the roots of the CuO needles during the compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior and thereby explain the formation of failure paths. It is believed that the adhesion model developed in the present work can be used to explain the adhesion behavior of other similar polymer/roughened metal systems.
AB - Roughening of metal surfaces frequently enhances the adhesion strength of polymers to metals by mechanical interlocking. When a failure occurs in a polymer/roughened metal system, the failure is prone to be cohesive within the polymer. In a previous work, an adhesion study on a polymer (epoxy molding compound, EMC/roughened metal (brown-oxide-coated copper-based leadframe) system was carried out, and the correlation between the failure path and adhesion strength was investigated. In the present work, an attempt to explain why such failure paths occurred was made under the assumption that microvoids were formed in the EMC, as well as near the roots of the CuO needles during the compression-molding process. A simple adhesion model developed from the theory of fiber reinforcement of composite materials was introduced to explain the adhesion behavior and thereby explain the formation of failure paths. It is believed that the adhesion model developed in the present work can be used to explain the adhesion behavior of other similar polymer/roughened metal systems.
KW - Adhesion
KW - Copper-based leadframe
KW - Epoxy molding compound
KW - Metal
KW - Polymer
UR - http://www.scopus.com/inward/record.url?scp=4444250251&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=4444250251&partnerID=8YFLogxK
U2 - 10.1163/1568561041581333
DO - 10.1163/1568561041581333
M3 - Article
AN - SCOPUS:4444250251
SN - 0169-4243
VL - 18
SP - 1153
EP - 1172
JO - Journal of Adhesion Science and Technology
JF - Journal of Adhesion Science and Technology
IS - 10
ER -