TY - GEN
T1 - Effect of La doping on SnAg solder microstructure evolution
AU - Pei, Min
AU - Qu, Jianmin
PY - 2007
Y1 - 2007
N2 - In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of La doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that La doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher La doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag3Sn particles.
AB - In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of La doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that La doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher La doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag3Sn particles.
UR - http://www.scopus.com/inward/record.url?scp=40449111821&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=40449111821&partnerID=8YFLogxK
U2 - 10.1115/IPACK2007-33701
DO - 10.1115/IPACK2007-33701
M3 - Conference contribution
AN - SCOPUS:40449111821
SN - 0791842770
SN - 9780791842775
T3 - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
SP - 407
EP - 413
BT - 2007 Proceedings of the ASME InterPack Conference, IPACK 2007
T2 - ASME Electronic and Photonics Packaging Division
Y2 - 8 July 2007 through 12 July 2007
ER -