Effect of La doping on SnAg solder microstructure evolution

Min Pei, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of La doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that La doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher La doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag3Sn particles.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Pages407-413
Number of pages7
DOIs
StatePublished - 2007
EventASME Electronic and Photonics Packaging Division - Vancouver, BC, United States
Duration: 8 Jul 200712 Jul 2007

Publication series

Name2007 Proceedings of the ASME InterPack Conference, IPACK 2007
Volume2

Conference

ConferenceASME Electronic and Photonics Packaging Division
Country/TerritoryUnited States
CityVancouver, BC
Period8/07/0712/07/07

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