TY - JOUR
T1 - Effect of lanthanum doping on the microstructure of tin-silver solder alloys
AU - Pei, Min
AU - Qu, Jianmin
PY - 2008/3
Y1 - 2008/3
N2 - In this study, quantitative microstructure studies were performed on multiple length scales to investigate the effect of lanthanum (La) doping on Sn-Ag lead-free solder materials. Factors considered in this paper include doping amount, aging temperature, and aging time. It was found that La doping reduces the grain size significantly, and the reduced grain size remains stable during thermal aging. The size of the Ag 3Sn particles is also greatly reduced by La doping, and the particles coarsen during thermal aging, albeit at a much reduced rate than in the undoped alloy. The rate of particle coarsening can be described by a cubic-root law. Another observation is that the interparticle spacing remains unaffected by the doping. Therefore, higher La doping level leads to higher volume fraction of the eutectic region due to the increased total number of Ag 3Sn particles.
AB - In this study, quantitative microstructure studies were performed on multiple length scales to investigate the effect of lanthanum (La) doping on Sn-Ag lead-free solder materials. Factors considered in this paper include doping amount, aging temperature, and aging time. It was found that La doping reduces the grain size significantly, and the reduced grain size remains stable during thermal aging. The size of the Ag 3Sn particles is also greatly reduced by La doping, and the particles coarsen during thermal aging, albeit at a much reduced rate than in the undoped alloy. The rate of particle coarsening can be described by a cubic-root law. Another observation is that the interparticle spacing remains unaffected by the doping. Therefore, higher La doping level leads to higher volume fraction of the eutectic region due to the increased total number of Ag 3Sn particles.
KW - Lead-free solder alloy
KW - Quantitative microstructure study
KW - Rare-earth element
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U2 - 10.1007/s11664-007-0335-x
DO - 10.1007/s11664-007-0335-x
M3 - Article
AN - SCOPUS:38349110491
SN - 0361-5235
VL - 37
SP - 331
EP - 338
JO - Journal of Electronic Materials
JF - Journal of Electronic Materials
IS - 3
ER -