TY - GEN
T1 - Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface
AU - Ferguson, Timothy P.
AU - Qu, Jianmin
N1 - Publisher Copyright:
© 2000 by ASME.
PY - 2000
Y1 - 2000
N2 - A primary concern in microelectronic packaging is the role of moisture induced failure mechanisms. Moisture is a multidimensional concern in packaging, having an adverse effect on package reliability by introducing corrosion, development of hygrostresses, and deterioration of polymer interfaces within the package. In this paper the effect of moisture on the interfacial adhesion of two no flow underfill materials with a commercially available soldermask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.
AB - A primary concern in microelectronic packaging is the role of moisture induced failure mechanisms. Moisture is a multidimensional concern in packaging, having an adverse effect on package reliability by introducing corrosion, development of hygrostresses, and deterioration of polymer interfaces within the package. In this paper the effect of moisture on the interfacial adhesion of two no flow underfill materials with a commercially available soldermask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated interface cracks are used in a four point bending test to quantify the interfacial fracture toughness. Two groups of test specimens of varying underfill thickness were constructed. The first group was fully dried while the other was moisture preconditioned at 85°C/85%RH for 725 hours. The results of this study show that the interfacial toughness is significantly affected by the presence of moisture.
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U2 - 10.1115/IMECE2000-2263
DO - 10.1115/IMECE2000-2263
M3 - Conference contribution
AN - SCOPUS:85120414433
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 129
EP - 133
BT - Packaging of Electronic and Photonic Devices
T2 - ASME 2000 International Mechanical Engineering Congress and Exposition, IMECE 2000
Y2 - 5 November 2000 through 10 November 2000
ER -