Effect of rare earth elements on lead-free solder microstructure evolution

Min Pei, Jianmin Qu

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

7 Scopus citations

Abstract

In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of rare earth element (RE) doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that RE doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher RE doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag 3Sn particles.

Original languageEnglish
Title of host publicationProceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
Pages198-204
Number of pages7
DOIs
StatePublished - 2007
Event57th Electronic Components and Technology Conference 2007, ECTC '07 - Sparks, NV, United States
Duration: 29 May 20071 Jun 2007

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Conference

Conference57th Electronic Components and Technology Conference 2007, ECTC '07
Country/TerritoryUnited States
CitySparks, NV
Period29/05/071/06/07

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