Effect of Thermal Residual Stresses on Polymer/Metal Interfacial Adhesion

In this study, the apparent fracture toughness of the interfaces of several epoxy-based polymeric adhesives and metal (aluminum) substrate is experimentally measured. Double layer specimens with initial interfacial cracks are made for four-point bending tests. Thermal residual stresses exist on the interface due to the coefficient of thermal expansion (CTE) mismatch between the underfill and aluminum. Silica fillers are used to modify the CTE of the epoxy-based adhesives so that various levels of interface thermal residual stresses are achieved. Finite element analysis is also performed to quantify the effects of CTE mismatch as well as the elastic mismatch across the interface. It is found that the apparent interfacial toughness is significantly affected by the thermal residual stress, while the effect of elastic mismatch is negligible. In general thermal residual stress undermines the resistance to an interfacial crack. In some cases the residual stress is sufficient to result in adhesive and/or cohesive failure.