TY - GEN
T1 - Effect of thermal residual stresses on the apparent interfacial toughness of epoxy/aluminum interface
AU - Yao, Qizhou
AU - Qu, Jianmin
N1 - Publisher Copyright:
© 1999 IEEE.
PY - 1999
Y1 - 1999
N2 - In this paper, the apparent fracture toughness of the interfaces of several epoxy-based adhesives and an aluminum substrate is experimentally measured. Double layer specimens with initial interfacial cracks are made for four-point bending tests. Thermal residual stresses exist on the interface due to the coefficient of thermal expansion (CTE) mismatch between the underfill and aluminum. Silica fillers are used to modify the CTE of the epoxy-based adhesives so that various levels of interface thermal residual stresses are achieved. It is found that the apparent interfacial toughness is significantly affected by the thermal residual stress. In general, thermal residual stress undermines the interfacial crack resistance. In some cases, the residual stress is sufficient to result in adhesive and/or cohesive failure.
AB - In this paper, the apparent fracture toughness of the interfaces of several epoxy-based adhesives and an aluminum substrate is experimentally measured. Double layer specimens with initial interfacial cracks are made for four-point bending tests. Thermal residual stresses exist on the interface due to the coefficient of thermal expansion (CTE) mismatch between the underfill and aluminum. Silica fillers are used to modify the CTE of the epoxy-based adhesives so that various levels of interface thermal residual stresses are achieved. It is found that the apparent interfacial toughness is significantly affected by the thermal residual stress. In general, thermal residual stress undermines the interfacial crack resistance. In some cases, the residual stress is sufficient to result in adhesive and/or cohesive failure.
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U2 - 10.1109/ISAPM.1999.757334
DO - 10.1109/ISAPM.1999.757334
M3 - Conference contribution
AN - SCOPUS:84858296800
T3 - Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces
SP - 333
EP - 336
BT - Proceedings - International Symposium on Advanced Packaging Materials
T2 - 1999 International Symposium on Advanced Packaging Materials
Y2 - 14 March 1999 through 17 March 1999
ER -