Effective elastic modulus of underfill material for flip-chip applications

Jianmin Qu, C. P. Wong

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

10 Scopus citations

Abstract

Most underfill materials are two phase composites, e.g., epoxy matrix filled with ceramic particles. The primary purpose of loading ceramic particles is to reduce the coefficient of thermal expansion (CTE) and to increase the elastic modulus. These two thermal mechanical properties are critical parameters to the thermomechanical reliability of a flip-chip package. Developing underfill materials with desired values of the CTE and elastic modulus is a key enabling technology for the next generation low-cost, high-reliability flip-chip packages. In this paper, a micromechanics model is developed to estimate the elastic modulus of underfill materials based on the properties of the matrix and the fillers. To validate the prediction from the micromechanics model, samples of underfill materials with various filler compositions are made. The moduli of these samples are measured using a Thermal Mechanical Analysis system (TMA). Satisfactory results are obtained between the theoretically predicted and experimentally measured values.

Original languageEnglish
Title of host publication1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998
Pages848-850
Number of pages3
DOIs
StatePublished - 1998
Event48th Electronic Components and Technology Conference, ECTC 1998 - Seattle, United States
Duration: 25 May 199828 May 1998

Publication series

NameProceedings - Electronic Components and Technology Conference
VolumePart F133492
ISSN (Print)0569-5503

Conference

Conference48th Electronic Components and Technology Conference, ECTC 1998
Country/TerritoryUnited States
CitySeattle
Period25/05/9828/05/98

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