TY - JOUR
T1 - Effective elastic modulus of underfill material for flip-chip applications
AU - Qu, Jianmin
AU - Wong, C. P.
PY - 2002/3
Y1 - 2002/3
N2 - In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.
AB - In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.
KW - Effective elastic modules
KW - Flip-chip, micromechanics
KW - Underfills
UR - http://www.scopus.com/inward/record.url?scp=0036506830&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0036506830&partnerID=8YFLogxK
U2 - 10.1109/6144.991175
DO - 10.1109/6144.991175
M3 - Article
AN - SCOPUS:0036506830
SN - 1521-3331
VL - 25
SP - 53
EP - 55
JO - IEEE Transactions on Components and Packaging Technologies
JF - IEEE Transactions on Components and Packaging Technologies
IS - 1
ER -