Effective elastic modulus of underfill material for flip-chip applications

Jianmin Qu, C. P. Wong

Research output: Contribution to journalArticlepeer-review

63 Scopus citations

Abstract

In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.

Original languageEnglish
Pages (from-to)53-55
Number of pages3
JournalIEEE Transactions on Components and Packaging Technologies
Volume25
Issue number1
DOIs
StatePublished - Mar 2002

Keywords

  • Effective elastic modules
  • Flip-chip, micromechanics
  • Underfills

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