Effective elastic modulus of underfill material for flip-chip applications

Jianmin Qu; C. P. Wong

doi:10.1109/6144.991175

Effective elastic modulus of underfill material for flip-chip applications

Jianmin Qu
, C. P. Wong

Research output: Contribution to journal › Article › peer-review

63 Scopus citations

Abstract

In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.

Original language	English
Pages (from-to)	53-55
Number of pages	3
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	25
Issue number	1
DOIs	https://doi.org/10.1109/6144.991175
State	Published - Mar 2002

Keywords

Effective elastic modules
Flip-chip, micromechanics
Underfills

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10.1109/6144.991175

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title = "Effective elastic modulus of underfill material for flip-chip applications",

abstract = "In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.",

keywords = "Effective elastic modules, Flip-chip, micromechanics, Underfills",

author = "Jianmin Qu and Wong, \{C. P.\}",

year = "2002",

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T1 - Effective elastic modulus of underfill material for flip-chip applications

AU - Qu, Jianmin

AU - Wong, C. P.

PY - 2002/3

Y1 - 2002/3

N2 - In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.

AB - In this paper, a micromechanics model based on the Mori-Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from this theory were compared with experimentally measured values. Excellent agreement was observed.

KW - Effective elastic modules

KW - Flip-chip, micromechanics

KW - Underfills

UR - https://www.scopus.com/pages/publications/0036506830

UR - https://www.scopus.com/pages/publications/0036506830#tab=citedBy

U2 - 10.1109/6144.991175

DO - 10.1109/6144.991175

M3 - Article

AN - SCOPUS:0036506830

SN - 1521-3331

VL - 25

SP - 53

EP - 55

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 1

ER -

Effective elastic modulus of underfill material for flip-chip applications

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