Effects of PWB size on the warpage of flip chip assemblies

Qizhou Yao, Jianmin Qu

Research output: Contribution to conferencePaperpeer-review

2 Scopus citations

Abstract

In this study, three-dimensional finite element analyses were used to study the stress distribution in and deflection of a flip chip assembly under thermal loading. The objective is to investigate the effect of printed wiring board size on the overall deflection of the flip-chip assembly. This size effect of the printed wiring board has significant implications on the design of multi-chip modules. The results indicate that a square array placement pattern is preferable to a staggered array for multiple chip modules in order to reduce mechanical interaction between chips. For square arrays, such mechanical interaction between chips can be neglected when the minimum distance between adjacent chips is more than 2 times the chip size.

Original languageEnglish
Pages1/-
StatePublished - 1999
EventInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA
Duration: 13 Jun 199919 Jun 1999

Conference

ConferenceInterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999'
CityMaui, HI, USA
Period13/06/9919/06/99

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