Abstract
In this study, three-dimensional finite element analyses were used to study the stress distribution in and deflection of a flip chip assembly under thermal loading. The objective is to investigate the effect of printed wiring board size on the overall deflection of the flip-chip assembly. This size effect of the printed wiring board has significant implications on the design of multi-chip modules. The results indicate that a square array placement pattern is preferable to a staggered array for multiple chip modules in order to reduce mechanical interaction between chips. For square arrays, such mechanical interaction between chips can be neglected when the minimum distance between adjacent chips is more than 2 times the chip size.
Original language | English |
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Pages | 1/- |
State | Published - 1999 |
Event | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' - Maui, HI, USA Duration: 13 Jun 1999 → 19 Jun 1999 |
Conference
Conference | InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999' |
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City | Maui, HI, USA |
Period | 13/06/99 → 19/06/99 |