Effects of PWB size on the warpage of flip chip assemblies

Qizhou Yao, Jianmin Qu

Research output: Contribution to journalArticlepeer-review

1 Scopus citations

Abstract

In this study, three-dimensional finite element analyses were used to study the stress distribution in and deflection of a flip chip assembly under thermal loading. The objective is to investigate the effect of printed wiring board size on the overall deflection of the flip-chip assembly. This size effect of the printed wiring board has significant implications on the design of multi-chip modules. The results indicate that a square array placement pattern is preferable to a staggered array for multiple chip modules in order to reduce mechanical interaction between chips. For square arrays, such mechanical interaction between chips can be neglected when the minimum distance between adjacent chips is more than 2 times the chip size.

Original languageEnglish
Pages (from-to)27-31
Number of pages5
JournalAmerican Society of Mechanical Engineers, EEP
Volume26 3
StatePublished - 1999

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