TY - JOUR
T1 - Electrical and thermal conductivities of polymer composites containing nano-sized particles
AU - Fan, Lianhua
AU - Su, Bin
AU - Qu, Jianmin
AU - Wong, C. P.
PY - 2004
Y1 - 2004
N2 - Polymer composite materials, for their cost-effectiveness and design flexibility, have been widely employed in electronic packaging industry. They possess unique characteristics combining the low-temperature processability of organic polymer matrix and the various functionalities endowed by the other components in the composites. Electrically conductive adhesives (EGAs) have been explored as an environment friendly interconnection technique. While they have many potential advantages for surface mount and flip chip applications, typical EGA materials suffer from several critical issues to be used as a drop-in replacement for lead-containing solders. In an attempt to understand and improve the thermomechanical properties of EGA materials, nano-sized silver particles were introduced into the conventional EGA compositions. The influence of nano particles on bulk resistivity is reported in this paper, as maintaining an acceptable conductivity is essential for high performance and environmentally benign interconnections. It was found that the bulk resistivity of EGA formulations strongly depended on the contents of silver flake and nano particles, as well as the particle morphology and surface properties. The thermal conductivity of alumina based composite samples was also affected upon the inclusion of nano alumina particles. Both the electrical and thermal conductivities of the polymer composites containing nano particles would be determined by the contacts of micro-sized particles and interfaces that involve nano particles along the conduction paths.
AB - Polymer composite materials, for their cost-effectiveness and design flexibility, have been widely employed in electronic packaging industry. They possess unique characteristics combining the low-temperature processability of organic polymer matrix and the various functionalities endowed by the other components in the composites. Electrically conductive adhesives (EGAs) have been explored as an environment friendly interconnection technique. While they have many potential advantages for surface mount and flip chip applications, typical EGA materials suffer from several critical issues to be used as a drop-in replacement for lead-containing solders. In an attempt to understand and improve the thermomechanical properties of EGA materials, nano-sized silver particles were introduced into the conventional EGA compositions. The influence of nano particles on bulk resistivity is reported in this paper, as maintaining an acceptable conductivity is essential for high performance and environmentally benign interconnections. It was found that the bulk resistivity of EGA formulations strongly depended on the contents of silver flake and nano particles, as well as the particle morphology and surface properties. The thermal conductivity of alumina based composite samples was also affected upon the inclusion of nano alumina particles. Both the electrical and thermal conductivities of the polymer composites containing nano particles would be determined by the contacts of micro-sized particles and interfaces that involve nano particles along the conduction paths.
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M3 - Conference article
AN - SCOPUS:10444256235
SN - 0569-5503
VL - 1
SP - 148
EP - 154
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - 2004 Proceedings - 54th Electronic Components and Technology Conference
Y2 - 1 June 2004 through 4 June 2004
ER -