TY - JOUR
T1 - Electrical resistance at carbon nanotube/copper interfaces
T2 - Capped versus open-end carbon nanotubes
AU - Gao, Feng
AU - Qu, Jianmin
AU - Yao, Matthew
PY - 2012/9/1
Y1 - 2012/9/1
N2 - This paper presents a study to compare the electrical resistance between a capped CNT/Cu interface and an open-end CNT/Cu interface. It is found that the capped CNT/Cu interface has (1) much weaker interfacial bond strength, due to the lack of dangling bonds of the carbon atoms at the CNT's capped end, as well as the reduced actual interfacial contact area, and (2) much higher electrical resistance because of the reduction and localization of density of states in the vicinity of the Fermi level.
AB - This paper presents a study to compare the electrical resistance between a capped CNT/Cu interface and an open-end CNT/Cu interface. It is found that the capped CNT/Cu interface has (1) much weaker interfacial bond strength, due to the lack of dangling bonds of the carbon atoms at the CNT's capped end, as well as the reduced actual interfacial contact area, and (2) much higher electrical resistance because of the reduction and localization of density of states in the vicinity of the Fermi level.
KW - Carbon nanotube
KW - Density of states
KW - Electrical resistance
KW - Interface
KW - Mulliken population
UR - http://www.scopus.com/inward/record.url?scp=84863095791&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84863095791&partnerID=8YFLogxK
U2 - 10.1016/j.matlet.2012.05.095
DO - 10.1016/j.matlet.2012.05.095
M3 - Article
AN - SCOPUS:84863095791
SN - 0167-577X
VL - 82
SP - 184
EP - 187
JO - Materials Letters
JF - Materials Letters
ER -