Original language | English |
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Journal | American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP |
State | Published - 2006 |
Event | 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: 5 Nov 2006 → 10 Nov 2006 |
Electronic and photonic packaging - Introduction
Research output: Contribution to journal › Editorial