Electronic and photonic packaging - Introduction

Research output: Contribution to journal › Editorial

Original language	English
Journal	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
State	Published - 2006
Event	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: 5 Nov 2006 → 10 Nov 2006

Cite this

TY - JOUR

T1 - Electronic and photonic packaging - Introduction

AU - Jianmin, Qu

PY - 2006

Y1 - 2006

UR - https://www.scopus.com/pages/publications/85195225617

UR - https://www.scopus.com/pages/publications/85195225617#tab=citedBy

M3 - Editorial

AN - SCOPUS:85195225617

SN - 1071-6947

JO - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

JF - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006

Y2 - 5 November 2006 through 10 November 2006

ER -