Energetic materials for integration on chip

Luke J. Currano, Wayne Churaman, Collin Becker, Christopher J. Morris, Leela M. Reddy, Andrew Ihnen, Pulickel Ajayan, Woo Y. Lee

Research output: Contribution to conferencePaperpeer-review

4 Scopus citations

Abstract

Several possible techniques for integrating energetic materials on an electronics or Microelectromechanical system (MEMS) chip are described. These include modifications to the bulk substrate material, deposition of thin films, and growth of nanotubes on top of the substrate. The specific material systems discussed are nanoporous energetic silicon, energetic carbon nanotubes, and solution-deposited RDX. The state of development of each of these three material systems is discussed.

Original languageEnglish
Pages30-36
Number of pages7
StatePublished - 2010
Event14th International Detonation Symposium, IDS 2010 - Coeur d'Alene, ID, United States
Duration: 11 Apr 201016 Apr 2010

Conference

Conference14th International Detonation Symposium, IDS 2010
Country/TerritoryUnited States
CityCoeur d'Alene, ID
Period11/04/1016/04/10

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