Abstract
Several possible techniques for integrating energetic materials on an electronics or Microelectromechanical system (MEMS) chip are described. These include modifications to the bulk substrate material, deposition of thin films, and growth of nanotubes on top of the substrate. The specific material systems discussed are nanoporous energetic silicon, energetic carbon nanotubes, and solution-deposited RDX. The state of development of each of these three material systems is discussed.
Original language | English |
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Pages | 30-36 |
Number of pages | 7 |
State | Published - 2010 |
Event | 14th International Detonation Symposium, IDS 2010 - Coeur d'Alene, ID, United States Duration: 11 Apr 2010 → 16 Apr 2010 |
Conference
Conference | 14th International Detonation Symposium, IDS 2010 |
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Country/Territory | United States |
City | Coeur d'Alene, ID |
Period | 11/04/10 → 16/04/10 |