TY - JOUR
T1 - Estimate the thermomechanical fatigue life of two chip scale packages
AU - Yao, Qizhou
AU - Qu, Jianmin
AU - Wu, Sean X.
PY - 1999
Y1 - 1999
N2 - In this paper, two three dimensional finite element models were developed to numerically compute the stress, total strain, plastic strain, and the cumulative plastic strain of the solder joints in a microBGA and a Chip Scale Package (CSP) under temperature cycling. These stress and strain values, along with the results of solder fatigue tests, were then used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). Particular attention was given to the complex temperature profile of the thermal loading. The estimated fatigue life for both packages are extremely high, indicating that the packages are well designed for thermomechanical reliability.
AB - In this paper, two three dimensional finite element models were developed to numerically compute the stress, total strain, plastic strain, and the cumulative plastic strain of the solder joints in a microBGA and a Chip Scale Package (CSP) under temperature cycling. These stress and strain values, along with the results of solder fatigue tests, were then used to predict the solder joint lifetime through either strain-based approaches such as Coffin-Manson and modified Coffin-Manson equations, or stress-based approach (S-N Curve). Particular attention was given to the complex temperature profile of the thermal loading. The estimated fatigue life for both packages are extremely high, indicating that the packages are well designed for thermomechanical reliability.
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M3 - Conference article
AN - SCOPUS:0032641905
SN - 0569-5503
SP - 797
EP - 802
JO - Proceedings - Electronic Components and Technology Conference
JF - Proceedings - Electronic Components and Technology Conference
T2 - Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC)
Y2 - 1 June 1999 through 4 June 1999
ER -