Fabrication and dynamic testing of electrostatic actuators with p+ silicon diaphragms

E. H. Yang; S. S. Yang; S. W. Han; S. Y. Kim

Fabrication and dynamic testing of electrostatic actuators with p⁺ silicon diaphragms

E. H. Yang
, S. S. Yang
, S. W. Han
, S. Y. Kim

Department of Mechanical Engineering

Ajou University

Research output: Contribution to conference › Paper › peer-review

Abstract

This paper presents the fabrication and testing of electrostatic actuators. The p⁺ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.

Original language	English
Pages	28-31
Number of pages	4
State	Published - 1995
Event	Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95 - Hong Kong, Hong Kong Duration: 6 Nov 1995 → 10 Nov 1995

Conference

Conference	Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95
City	Hong Kong, Hong Kong
Period	6/11/95 → 10/11/95

Cite this

@conference{23066091a8c740d0a5a8f12dd67ed05e,

title = "Fabrication and dynamic testing of electrostatic actuators with p+ silicon diaphragms",

abstract = "This paper presents the fabrication and testing of electrostatic actuators. The p+ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a \#7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.",

author = "Yang, \{E. H.\} and Yang, \{S. S.\} and Han, \{S. W.\} and Kim, \{S. Y.\}",

year = "1995",

language = "English",

pages = "28--31",

note = "Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95 ; Conference date: 06-11-1995 Through 10-11-1995",

}

TY - CONF

T1 - Fabrication and dynamic testing of electrostatic actuators with p+ silicon diaphragms

AU - Yang, E. H.

AU - Yang, S. S.

AU - Han, S. W.

AU - Kim, S. Y.

PY - 1995

Y1 - 1995

N2 - This paper presents the fabrication and testing of electrostatic actuators. The p+ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.

AB - This paper presents the fabrication and testing of electrostatic actuators. The p+ diaphragm is used as a moving electrode, whereas the aluminum layer deposited on a #7740 pyrex glass is used as a fixed electrode. The dynamic characteristics of the actuator with the corrugated diaphragm and that with the flat one are tested and compared with the calculation results, respectively.

UR - https://www.scopus.com/pages/publications/0029488331

UR - https://www.scopus.com/pages/publications/0029488331#tab=citedBy

M3 - Paper

AN - SCOPUS:0029488331

SP - 28

EP - 31

T2 - Proceedings of the 1995 IEEE Region 10 International Conference on Microelectronics and VLSI, TENCON'95

Y2 - 6 November 1995 through 10 November 1995

ER -

Fabrication and dynamic testing of electrostatic actuators with p⁺ silicon diaphragms

Abstract

Conference

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