TY - GEN
T1 - Fabrication of polymeric and polymeric nano-composite MEMS structures
AU - Li, Daizong
AU - Tumkor, Serdar
AU - Manoochehri, Souran
AU - Pochiraju, Kishore
PY - 2010
Y1 - 2010
N2 - This paper presents methodologies for rapid prototyping of complex and functional polymeric MEMS structures using lithography steps only. In order to overcome stiffness and strength limitations of the polymeric structures, reinforcing nanomaterials were added to enhance stiffness. A challenge in processing polymeric MEMS devices is achieving the release of the MEMS structure from the substrate. This paper presents several process sequences and photoresist combinations that produce freestanding polymeric MEMS structures. Negative photoresist (SU8) and positive photoresist (AZ4620) materials were used in spin coat, bake, exposure and selective development steps. This paper describes the experiments used for determining the optimal process parameters and the release performance. In addition, the paper also illustrates exposure control techniques that reduce process-induced defects such as heat- induced bubbles, degassing and overexposure.
AB - This paper presents methodologies for rapid prototyping of complex and functional polymeric MEMS structures using lithography steps only. In order to overcome stiffness and strength limitations of the polymeric structures, reinforcing nanomaterials were added to enhance stiffness. A challenge in processing polymeric MEMS devices is achieving the release of the MEMS structure from the substrate. This paper presents several process sequences and photoresist combinations that produce freestanding polymeric MEMS structures. Negative photoresist (SU8) and positive photoresist (AZ4620) materials were used in spin coat, bake, exposure and selective development steps. This paper describes the experiments used for determining the optimal process parameters and the release performance. In addition, the paper also illustrates exposure control techniques that reduce process-induced defects such as heat- induced bubbles, degassing and overexposure.
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U2 - 10.1115/IMECE2009-12460
DO - 10.1115/IMECE2009-12460
M3 - Conference contribution
AN - SCOPUS:77954246312
SN - 9780791843857
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 309
EP - 313
BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
T2 - ASME 2009 International Mechanical Engineering Congress and Exposition, IMECE2009
Y2 - 13 November 2009 through 19 November 2009
ER -