TY - GEN
T1 - Facile and high-throughput fabrication of carbon nanotube carpet-pdms structures toward flexible supercapacitors
AU - Zhang, R.
AU - Ding, J.
AU - Liu, C.
AU - Yang, E. H.
PY - 2017
Y1 - 2017
N2 - Flexible electronics have a wide range of applications in wearable and multifunctional electronics. Consequently, technologies for flexible energy storage need to be developed for flexible electronic devices. Here, we develop a facile fabrication technique utilizing vertically aligned carbon nanotubes (VACNTs), which enables highthroughput fabrication of flexible supercapacitors. Our unique technique ensures a strong adhesion between VACNTs and polydimethylsiloxane (PDMS), which facilitates a stable charge/discharge under varied strains. The measured capacitance is 170 μF/cm2 at a high scanning rate of 1 V/s. In addition, the strong adhesion between VACNTs and PDMS enables the structure to sustain various bending strains. The capacitance under bending strains was found to be consistent under the bending angle varying from 0 to 180 degrees.
AB - Flexible electronics have a wide range of applications in wearable and multifunctional electronics. Consequently, technologies for flexible energy storage need to be developed for flexible electronic devices. Here, we develop a facile fabrication technique utilizing vertically aligned carbon nanotubes (VACNTs), which enables highthroughput fabrication of flexible supercapacitors. Our unique technique ensures a strong adhesion between VACNTs and polydimethylsiloxane (PDMS), which facilitates a stable charge/discharge under varied strains. The measured capacitance is 170 μF/cm2 at a high scanning rate of 1 V/s. In addition, the strong adhesion between VACNTs and PDMS enables the structure to sustain various bending strains. The capacitance under bending strains was found to be consistent under the bending angle varying from 0 to 180 degrees.
KW - Fabrication process
KW - Flexible supercapacitors
KW - PDMS
KW - Vertically aligned carbon nanotubes
UR - http://www.scopus.com/inward/record.url?scp=85029447961&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85029447961&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:85029447961
T3 - Advanced Materials - TechConnect Briefs 2017
SP - 44
EP - 47
BT - Advanced Materials - TechConnect Briefs 2017
A2 - Laudon, Matthew
A2 - Case, Fiona
A2 - Romanowicz, Bart
A2 - Case, Fiona
T2 - 11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo, and the 2017 National SBIR/STTR Conference
Y2 - 14 May 2017 through 17 May 2017
ER -