TY - GEN
T1 - Hierarchical modeling of creep behavior of SnAg solder alloys
AU - Pei, Min
AU - Qu, Jianmin
PY - 2007
Y1 - 2007
N2 - In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of submicron size Ag 3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
AB - In this paper, a microstructure-dependent creep model is developed that accounts for the hierarchal microstructure at multiple length scales. The model considers three distinguishable phases in the solder alloy at two different length scales: at the larger scale Sn dendrites of micrometer size are embedded in a homogeneous eutectic phase; at a much smaller length scale the eutectic phase consists of submicron size Ag 3Sn particles embedded in a homogeneous Sn matrix. The model predictions agree well with creep test data of RE doped SnAg solders.
UR - http://www.scopus.com/inward/record.url?scp=35348883588&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=35348883588&partnerID=8YFLogxK
U2 - 10.1109/ECTC.2007.373809
DO - 10.1109/ECTC.2007.373809
M3 - Conference contribution
AN - SCOPUS:35348883588
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 273
EP - 277
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -